wafer handling equipment

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• Wafer testing — is a step performed during semiconductor device fabrication. During this step, performed before a wafer is sent to die preparation, all individual integrated circuits that are present on the wafer are tested for functional defects by applying… …   Wikipedia

• Wafer dicing — is the process by which individual silicon chips or integrated circuits on a silicon wafer are separated following the processing of the wafer. The dicing process can be accomplished by scribing and breaking, by mechanical sawing (normally with a …   Wikipedia

• building construction — Techniques and industry involved in the assembly and erection of structures. Early humans built primarily for shelter, using simple methods. Building materials came from the land, and fabrication was dictated by the limits of the materials and… …   Universalium

• computer — computerlike, adj. /keuhm pyooh teuhr/, n. 1. Also called processor. an electronic device designed to accept data, perform prescribed mathematical and logical operations at high speed, and display the results of these operations. Cf. analog… …   Universalium

• Mathematics and Physical Sciences — ▪ 2003 Introduction Mathematics       Mathematics in 2002 was marked by two discoveries in number theory. The first may have practical implications; the second satisfied a 150 year old curiosity.       Computer scientist Manindra Agrawal of the… …   Universalium

• Integrated circuit — Silicon chip redirects here. For the electronics magazine, see Silicon Chip. Integrated circuit from an EPROM memory microchip showing the memory blocks, the supporting circuitry and the fine silver wires which connect the integrated circuit die… …   Wikipedia

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• semiconductor device — ▪ electronics Introduction       electronic circuit component made from a material that is neither a good conductor nor a good insulator (hence semiconductor). Such devices have found wide applications because of their compactness, reliability,… …   Universalium